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Part Number: BZV55-C3V6,115
Make: NXP / Nexperia
1,467,500 In Stock.
Shipping From: HongKong, China
Delivery in 5-9 Business Days
100% Warrantied Inventory (ISO 9001:2015 Certified)

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Available Quantity: 1,467,500
Standard Package Quantity: 2,500

Specifications : BZV55-C3V6,115

Brand Name NXP Semiconductor
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Dynamic Impedance-Max 90 Ω
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Keywords 9336 994 10115
Manufacturer NXP Semiconductors
Manufacturer Package Code SOD80C
Manufacturer Part Number BZV55-C3V6,115
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Description O-LELF-R2
Package Shape ROUND
Package Style LONG FORM
Packaging -
Part Package Code MELF
Peak Reflow Temperature (Cel) 260
Pin Count 2
Power Dissipation (Max) 400 mW
Qualification Status Not Qualified
Reference Voltage-Nom 3.6 V
Reverse Current-Max 5 µA
Subcategory Voltage Reference Diodes
Surface Mount YES
Technology ZENER
Terminal Finish Tin (Sn)
Terminal Form WRAP AROUND
Terminal Position END
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max 0 mV/°C
Voltage Tol-Max 5 %
Working Test Current 5 mA