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GS8182D36BD-200


Part Number: GS8182D36BD-200
Make: GSI Tech
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Specifications : GS8182D36BD-200

Access Time-Max 450 ps
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165
JESD-609 Code e0
Length 15 mm
Manufacturer GSI Technology
Manufacturer Part Number GS8182D36BD-200
Memory Density 18.8744 Mbit
Memory IC Type DDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 165
Number of Words 524.288 k
Number of Words Code 512000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min 0 °C
Organization 512KX36
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Description LBGA,
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Packaging -
Parallel/Serial PARALLEL
Part Package Code BGA
Pbfree Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Pin Count 165
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm