No Image
4 / 5 (2 ratings)

H5AN4G6NAFR-UHC


Part Number: H5AN4G6NAFR-UHC
Make: SK Hynix
Out Of Stock
100% Warrantied Inventory (ISO 9001:2015 Certified)

Submit RFQ: H5AN4G6NAFR-UHC


Specifications : H5AN4G6NAFR-UHC

Access Mode MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B96
Length 13 mm
Manufacturer SK Hynix Inc
Manufacturer Part Number H5AN4G6NAFR-UHC
Memory Density 4.295 Gbit
Memory IC Type DDR DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 268.4355 M
Number of Words Code 256000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min 0 °C
Organization 256MX16
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Description TFBGA,
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Packaging -
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 1.26 V
Supply Voltage-Min (Vsup) 1.14 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 800 µm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 7.5 mm