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W25N01GVTCIG


Part Number: W25N01GVTCIG
Make: Winbond
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Specifications : W25N01GVTCIG

Clock Frequency-Max (fCLK) 104 MHz
Data Retention Time-Min 10
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24
Length 8 mm
Manufacturer Winbond Electronics Corp
Manufacturer Part Number W25N01GVTCIG
Memory Density 1.0737 Gbit
Memory IC Type FLASH
Memory Width 1
Number of Functions 1
Number of Terminals 24
Number of Words 1.0737 G
Number of Words Code 1000000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1GX1
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Description TBGA, BGA24,4X6,40
Package Equivalence Code BGA24,4X6,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Packaging -
Parallel/Serial SERIAL
Power Supplies 3/3.3 V
Programming Voltage 3 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Serial Bus Type SPI
Standby Current-Max 50 µA
Subcategory Flash Memories
Supply Current-Max 35 µA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE