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XC6SLX100-2FGG676C


Part Number: XC6SLX100-2FGG676C
Make: Xilinx
320 In Stock.
Shipping From: HongKong, China
Delivery in 5-9 Business Days
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Available Quantity: 320
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Standard Package Quantity: 40
Date Code: 15+

Specifications : XC6SLX100-2FGG676C

Clock Frequency-Max 667 MHz
Combinatorial Delay of a CLB-Max 260 ps
JESD-30 Code S-PBGA-B676
JESD-609 Code e1
Length 27 mm
Manufacturer Xilinx
Manufacturer Part Number XC6SLX100-2FGG676C
Moisture Sensitivity Level 3
Number of CLBs 7911
Number of Inputs 480
Number of Logic Cells 101261
Number of Outputs 480
Number of Terminals 676
Operating Temperature-Max 85 °C
Operating Temperature-Min 0 °C
Organization 7911 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Description BGA, BGA676,26X26,40
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Packaging -
Part Package Code BGA
Pbfree Code Yes
Peak Reflow Temperature (Cel) 250
Pin Count 676
Power Supplies 1.2,2.5/3.3 V
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.44 mm
Subcategory Field Programmable Gate Arrays
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm